A lot less long than it would take for China to develop their own 3 nM EUV lithography process. There's more to making chips than a few engineers and a plant.

FABs as they are called are very high level cleanrooms. And any such cleanroom is already not easy to achieve anywhere anytime. But on top of that, this cleanroom has heavy machinery operating in it, while the requirement for that level of purity is constant and continuous. And that's just the building.

Then you start talking about the actual lithography process and that requires physicists and engineers who have whole careers behind them in this business, because every single process node ( the size of transistors within these chips ) is more complex and more prone to errors than the previous. So essentially this means that the Taiwanese expertise is pretty much impossible to replace.

And the silicon wafers. At the current and future process nodes, these wafers have to be perfect almost to the atomic level. Just the expertise for making these would be problematic to develop.

Certainly Israelis aren't going to do it, since they've had untold trouble with even a 5-year-old 10 nM process, which they aren't even yet able to produce while it is a completely obsolete process now.

So the expertise at the newer process nodes is all Taiwanese. Re-engineering it would take at least 10 years with tons and tons of industrial espionage. I don't think the Chinese have it in them to achieve this at all, or they would have done it already.